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UITP Asia Pacific Congress Partners with Busworld Asia

UITP Asia Pacific Congress Partners with Busworld Asia

23.11.2010 — News


HONG KONG.

The Sixth Annual Session of UITP (The International Association of Public Transport) Asia Pacific Region`s Congress took place this November 15th to 19th in Hong Kong, with Busworld Asia joining forces with UITP to promote its upcoming 2011 Exhibition.

UITP is the leading international authority on public transportation and transit. This year`s edition of UITP invited some 420 public transportation government officials and passenger transport experts from the public transportation fields of China, Japan, Singapore, India and other countries across Southeast Asia, the Asia Pacific, Europe and the Americas to dialogue and brainstorm regarding the latest in industry developments and the increasing global demand for public transportation.

Busworld Asia, a member of the BAAV Busworld Global Alliance managed by VNU Exhibitions, is the only professionally oriented bus and coach exhibition in Asia today. On the afternoon of November 17th, UITP 2010 congress members / public transportation providers from all around the world were invited to attend the 2011 edition of Busworld Asia to observe firsthand the advances in new energy based technologies on display in Chinese buses. Shanghai, the leading global city for new energy bus transportation usage, is the ideal backdrop for Busworld Asia 2011.

The 11th annual Edition of the International Busworld Asia Exhibition is set to take place from March 30th to April 1st 2011 in Shanghai. The Exhibition press office informed RusBusinessNews than in the coming period, a national public transportation purchasing delegation from India and a leading Israeli transportation minister will be among the first to be welcomed by Busworld Asia; facilitating expanded international commerce and dialogue. With great interest expressed by India and Israel among a number of other countries, these are the first of many trade based relationships in the making.

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